Resultados de búsqueda - ((tteste OR tested) OR (est OR ((testa OR (beste OR text)) OR (este OR esten)))) point*

  1. 281
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    Development and Evaluation of An In-House Lumbar Puncture Simulator for First-Year Resident Lumbar Puncture Procedure Learning por Muñoz Leija, David, Díaz González Colmenero, Fernando, Ramiréz Mendoza, Diego A, López Cabrera, Norma Guadalupe, Llanes Garza, Hilda Alicia, Palacios Ríos, Dionicio, Negreros Osuna, Adrian Antonio

    Publicado 2024
    “…While there were no apparent differences in median self-confidence scores between the groups at any time point, the experimental group had a significant increase in their self-confidence for performing an unassisted LP, with a median score of 1/5 (1 2.3) at baseline and 5/5 (4.8 - 5) after six months (p = 0.006). …”
    Enlace del recurso
    Artículo
  3. 283

    A stochastic location-inventory problem: complexity and mathematical formulations. por Hernández González, Nelly Montserrat

    Publicado 2017
    “…In our case they are limited as single source, which means that each demand point should be serviced by a single supply point. …”
    Enlace del recurso
    Tesis
  4. 284

    A stochastic location-inventory problem: complexity and mathematical formulations. por Hernández González, Nelly Montserrat

    Publicado 2017
    “…In our case they are limited as single source, which means that each demand point should be serviced by a single supply point. …”
    Enlace del recurso
    Tesis
  5. 285

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  6. 286

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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