Resultados de búsqueda - ((teste OR testaao) OR (est OR ((testa OR (estas OR testadas)) OR (estardos OR estado)))) point

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    Contexto social y personalidad resistente en el deportista de Centroamérica por Ponce Carbajal, Nancy, Tristán Rodríguez, José Leandro, Jaenes Sánchez, José Carlos, Castillo Jiménez, Nallely

    Publicado 2017
    “…Los objetivos de este trabajo son la identificación de los factores del contexto social que influyen en la resistencia al estrés de los deportistas de alto nivel y a su vez determinar el factor del contexto social que perciben los atletas como de mayor influencia para la personalidad resistente. …”
    Enlace del recurso
    Artículo
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    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. por Vargas Martínez, Ramiro Emmanuel

    Publicado 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
    Enlace del recurso
    Tesis
  14. 154

    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. por Vargas Martínez, Ramiro Emmanuel

    Publicado 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
    Enlace del recurso
    Tesis
  15. 155

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  16. 156

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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