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  1. 221

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
  2. 222

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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    Caracterización electroquímica de la pasivación de acero inoxidable empleado en la fabricación de fuselajes de helicópteros. by Lara Banda, María del Refugio

    Published 2018
    “…In general when talking about this type of helicopter, investigations are carried out with the first point to consider the safety of those who operate it, together with the factors to which it will be exposed, among which we can mention: environmental conditions, weight and resistance to corrosion, among others. …”
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    Tesis

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