Search Results - ((testas OR testeo) OR ((esto OR tested) OR (estes OR (estado OR (gestor OR testa))))) point

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    Contexto social y personalidad resistente en el deportista de Centroamérica by Ponce Carbajal, Nancy, Tristán Rodríguez, José Leandro, Jaenes Sánchez, José Carlos, Castillo Jiménez, Nallely

    Published 2017
    “…The results showed that, from athletes’ point of view, themselves and their skills, as well as coaches, are the factors of social context that mostly influence hardiness. …”
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    Article
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    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. by Vargas Martínez, Ramiro Emmanuel

    Published 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
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    Tesis
  15. 155

    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. by Vargas Martínez, Ramiro Emmanuel

    Published 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
    Get full text
    Tesis
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
  17. 157

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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