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  1. 261

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
  2. 262

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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  6. 266

    Decoding kinematic variables from electroencephalographic signals during lower limb mobility protocols by Mercado Cerda, Luis Antonio

    Published 2019
    “…Both results could be starting points to further improve the understanding of neuro-motor tasks and their application of artificial reproduction of movements from EEG signals through a BCI.…”
    Get full text
    Tesis
  7. 267

    Decoding kinematic variables from electroencephalographic signals during lower limb mobility protocols by Mercado Cerda, Luis Antonio

    Published 2019
    “…Both results could be starting points to further improve the understanding of neuro-motor tasks and their application of artificial reproduction of movements from EEG signals through a BCI.…”
    Get full text
    Tesis

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