Resultados de búsqueda - ((testaeem OR esto) OR ((est OR teste) OR ((estado OR rested) OR (estados OR testa)))) point*

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    Análisis de las motivaciones, factores de éxito y obstáculos al espíritu empresarial: estudio comparativo entre México, EEUU y Turquía (Analysis of motivations, factors of success... por Partida Puente, Abel, Carrera Sánchez, María Margarita, Villarreal Villarreal, Luis Alberto

    Publicado 2012
    “…These authors proposed to considerate the entrepreneur process as functions, activities and actions associated with the perception of opportunity and the creations of the organization to take advantage of. As beginning point, Gartner (1985) proposed to considerate the essential elements of the entrepreneur study: a) the environment b) the characteristics of the individual, c) the process and d) the Organization created. …”
    Enlace del recurso
    Artículo
  4. 184

    Analyses of chondrogenic induction of adipose mesenchymal stem cells by combined co-stimulation mediated by adenoviral gene transfer por Garza Veloz, Idalia, Romero Díaz, Víktor J., Martínez Fierro, Margarita de la Luz, Marino Martínez, Iván Alberto, González Rodríguez, Manuel, Martínez Rodríguez, Herminia Guadalupe, Espinoza Juárez, Marcela Alejandra, Bernal Garza, Dante A., Ortiz López, Rocío, Rojas Martínez, Augusto

    Publicado 2013
    “…These were harvested at various time points for detection of cartilage-specific genes expression by quantitative real-time PCR or after 14 and 28 days for histologic and biochemical analyses detecting proteoglycans, collagens (II, I and X), and total sulfated glycosaminoglycan and collagen content, respectively. …”
    Enlace del recurso
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  7. 187

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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    Decoding kinematic variables from electroencephalographic signals during lower limb mobility protocols por Mercado Cerda, Luis Antonio

    Publicado 2019
    “…Both results could be starting points to further improve the understanding of neuro-motor tasks and their application of artificial reproduction of movements from EEG signals through a BCI.…”
    Enlace del recurso
    Tesis
  16. 196

    Decoding kinematic variables from electroencephalographic signals during lower limb mobility protocols por Mercado Cerda, Luis Antonio

    Publicado 2019
    “…Both results could be starting points to further improve the understanding of neuro-motor tasks and their application of artificial reproduction of movements from EEG signals through a BCI.…”
    Enlace del recurso
    Tesis
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