Resultados de búsqueda - ((tesis OR ttesto) OR ((est OR (teseo OR tested)) OR (este OR (esteva OR estoao)))) point*

  1. 241

    Comparisons of the Root Mechanical Properties of three Native Mexican Tree Species for Soil Bioengineering Practices por Sánchez Castillo, Laura Margarita, Kubota, Tetsuya, Cantú Silva, Israel, Yáñez Díaz, María Inés, Hasnawir, Pequeño Ledezma, Miguel Angel

    Publicado 2017
    “…In other hand, results confirmed the negative relationship between diameter and tensile strength and diameter and modulus of elasticity. Pointing out that roots of bigger diameter have less tensile strength and elasticity. …”
    Enlace del recurso
    Artículo
  2. 242
  3. 243
  4. 244
  5. 245
  6. 246
  7. 247
  8. 248

    EVALUACIÓN DE RIESGO A LA SALUD EN LA COMUNIDAD DE LOMA BLANCA (DISTRITO DE RIEGO 009) VALLE DE JUAREZ (MEXICO), POR EXPOSICIÓN A AGUAS RESIDUALES NO TRATADAS por Garza Almanza, Victoriano, Fernández Salas, Ildefonso, Badii, Mohammad, Flores Suárez, Adriana, Hauad Marroquín, Leticia, Villarreal Rivera, Leticia

    Publicado 2001
    “…The result of the evaluation points out that the category of risk is high. Theconclusion is based on the analysis of data on the environment, characteristic of housing, habits ofconsumption of water and vegetables, perception of the risk on the part of the community, andmorbidity levels.Palabras calve: Loma Blanca, Valle de Juarez, valoración del riesgo, aguas residuales, risk value, residual waters.…”
    Enlace del recurso
    Artículo
  9. 249
  10. 250
  11. 251
  12. 252
  13. 253
  14. 254

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  15. 255

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  16. 256

    Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave. por Montoya Rangel, Marvin

    Publicado 2018
    “…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
    Enlace del recurso
    Tesis
  17. 257

    Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave. por Montoya Rangel, Marvin

    Publicado 2018
    “…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
    Enlace del recurso
    Tesis
  18. 258
  19. 259
  20. 260

Herramientas de búsqueda: