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  1. 281

    Social network externalities and price dispersion in online markets por Ayala Gaytán, Edgardo Arturo

    Publicado 2009
    “…Consumers cannot physically touch or examine the products at the point of purchase. As such, online markets involve an adoption process based on the interaction of consumers’ experiences in the form of references, recommendations, word of mouth, etc. …”
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  2. 282

    Prevalence of sensorineural hearing loss in children and adolescents with diabetes mellitus por Treviño González, José Luis, Campuzano Bustamante, D. I., Flores Caloca, O., Santos Lartigue, Ramiro, Villegas González, M. J.

    Publicado 2015
    “…Moreover, 65.47% of the patients presented complications due to poor glycemic control at some point in the evolution of their disease. All (100%) diabetic patients with SNHL and 91% of the patients without SNHL had HbA1c values greater than 6%. …”
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  3. 283
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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  5. 285

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  6. 286
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