Search Results - ((estos OR tested) OR ((est OR testar) OR ((rtestos OR estae) OR (esteeo OR estaedo)))) point*

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    Las teorías de la localización de la inversión extranjera directa (IED): una aproximación (Localization theories of the foreign direct investment: an approach) by Villarreal, C.

    Published 2004
    “…The concepts are presented and fundamental definitions related to the theme are pointed out. Finally, I offer a new perspective as how to conduct reasearch on this subject.…”
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    Article
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    Development and Evaluation of An In-House Lumbar Puncture Simulator for First-Year Resident Lumbar Puncture Procedure Learning by Muñoz Leija, David, Díaz González Colmenero, Fernando, Ramiréz Mendoza, Diego A, López Cabrera, Norma Guadalupe, Llanes Garza, Hilda Alicia, Palacios Ríos, Dionicio, Negreros Osuna, Adrian Antonio

    Published 2024
    “…While there were no apparent differences in median self-confidence scores between the groups at any time point, the experimental group had a significant increase in their self-confidence for performing an unassisted LP, with a median score of 1/5 (1 2.3) at baseline and 5/5 (4.8 - 5) after six months (p = 0.006). …”
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    Article
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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