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  1. 261

    Social network externalities and price dispersion in online markets por Ayala Gaytán, Edgardo Arturo

    Publicado 2009
    “…Consumers cannot physically touch or examine the products at the point of purchase. As such, online markets involve an adoption process based on the interaction of consumers’ experiences in the form of references, recommendations, word of mouth, etc. …”
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  2. 262

    Prevalence of sensorineural hearing loss in children and adolescents with diabetes mellitus por Treviño González, José Luis, Campuzano Bustamante, D. I., Flores Caloca, O., Santos Lartigue, Ramiro, Villegas González, M. J.

    Publicado 2015
    “…Moreover, 65.47% of the patients presented complications due to poor glycemic control at some point in the evolution of their disease. All (100%) diabetic patients with SNHL and 91% of the patients without SNHL had HbA1c values greater than 6%. …”
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  3. 263

    INTERVENCION NUTRICIONAL A PACIENTES CON ENFERMEDAD DE PARKINSON por Flores Solís, María Dolores, Gómez García, Anel, Ibarra Bravo, Octavio Miguel, Punzo Bravo, Guillermo

    Publicado 2017
    “…Dysphagia was the one with the highest nutritional response, 45 percentage points lower than the initial one, followed by constipation with 31.5 Percentage points, 74.3% of the patients maintained their CMB values at the end of the initial one, and the rest of them increased their values. …”
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  4. 264
  5. 265

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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  6. 266

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  7. 267

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