Resultados de búsqueda - ((esteve OR tested) OR ((est OR esteeres) OR ((catodo OR estos) OR (beste OR esta)))) point*

  1. 221

    Prevalence of sensorineural hearing loss in children and adolescents with diabetes mellitus por Treviño González, José Luis, Campuzano Bustamante, D. I., Flores Caloca, O., Santos Lartigue, Ramiro, Villegas González, M. J.

    Publicado 2015
    “…Moreover, 65.47% of the patients presented complications due to poor glycemic control at some point in the evolution of their disease. All (100%) diabetic patients with SNHL and 91% of the patients without SNHL had HbA1c values greater than 6%. …”
    Enlace del recurso
    Artículo
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    Estrategias para una sucesión exitosa en la empresa familiar = Strategies for a sucessuful succession in family business. por García, Mayra E.

    Publicado 2007
    “…The strategies proposed in this study are: Creating a Family Business Conseil; Choosing the succesor from an analitical point of view; Get pschicologist support in the succesion period; To create a Business Society; Partial Retirement of Director; An adequate compensation management; Open communication among all the members; and a provisional management. …”
    Enlace del recurso
    Artículo
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  11. 231

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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