Search Results - ((estevane OR tested) OR ((est OR estae) OR ((prestas OR testas) OR (esto OR estado)))) point

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    Contexto social y personalidad resistente en el deportista de Centroamérica by Ponce Carbajal, Nancy, Tristán Rodríguez, José Leandro, Jaenes Sánchez, José Carlos, Castillo Jiménez, Nallely

    Published 2017
    “…Los objetivos de este trabajo son la identificación de los factores del contexto social que influyen en la resistencia al estrés de los deportistas de alto nivel y a su vez determinar el factor del contexto social que perciben los atletas como de mayor influencia para la personalidad resistente. …”
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    Article
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    Estrategias para una sucesión exitosa en la empresa familiar = Strategies for a sucessuful succession in family business. by García, Mayra E.

    Published 2007
    “…Las estrategias presentadas en este estudio deben ser promovidas por el Director de la Empresa Familiar quien debe encargarse de dirigir a su equipo directivo rumbo al éxito en la transición de poder. …”
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    Article
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    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. by Vargas Martínez, Ramiro Emmanuel

    Published 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
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    Tesis
  16. 176

    Perspectiva del recuerdo, valencia e intensidad emocional en adolescentes. by Vargas Martínez, Ramiro Emmanuel

    Published 2018
    “…They answered two scalar questions series with five points of rating degrees for eight emotional states, four positive and four negative valence. …”
    Get full text
    Tesis
  17. 177

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
  18. 178

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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