Resultados de búsqueda - ((esteva OR gestores) OR ((est OR estoevan) OR ((restoos OR tested) OR (text OR este)))) point*

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    Prevalence of sensorineural hearing loss in children and adolescents with diabetes mellitus por Treviño González, José Luis, Campuzano Bustamante, D. I., Flores Caloca, O., Santos Lartigue, Ramiro, Villegas González, M. J.

    Publicado 2015
    “…Moreover, 65.47% of the patients presented complications due to poor glycemic control at some point in the evolution of their disease. All (100%) diabetic patients with SNHL and 91% of the patients without SNHL had HbA1c values greater than 6%. …”
    Enlace del recurso
    Artículo
  4. 264

    Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave. por Montoya Rangel, Marvin

    Publicado 2018
    “…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
    Enlace del recurso
    Tesis
  5. 265

    Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave. por Montoya Rangel, Marvin

    Publicado 2018
    “…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
    Enlace del recurso
    Tesis
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  8. 268

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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