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    Analyses of chondrogenic induction of adipose mesenchymal stem cells by combined co-stimulation mediated by adenoviral gene transfer by Garza Veloz, Idalia, Romero Díaz, Víktor J., Martínez Fierro, Margarita de la Luz, Marino Martínez, Iván Alberto, González Rodríguez, Manuel, Martínez Rodríguez, Herminia Guadalupe, Espinoza Juárez, Marcela Alejandra, Bernal Garza, Dante A., Ortiz López, Rocío, Rojas Martínez, Augusto

    Published 2013
    “…These were harvested at various time points for detection of cartilage-specific genes expression by quantitative real-time PCR or after 14 and 28 days for histologic and biochemical analyses detecting proteoglycans, collagens (II, I and X), and total sulfated glycosaminoglycan and collagen content, respectively. …”
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    Article
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    Development and Evaluation of An In-House Lumbar Puncture Simulator for First-Year Resident Lumbar Puncture Procedure Learning by Muñoz Leija, David, Díaz González Colmenero, Fernando, Ramiréz Mendoza, Diego A, López Cabrera, Norma Guadalupe, Llanes Garza, Hilda Alicia, Palacios Ríos, Dionicio, Negreros Osuna, Adrian Antonio

    Published 2024
    “…While there were no apparent differences in median self-confidence scores between the groups at any time point, the experimental group had a significant increase in their self-confidence for performing an unassisted LP, with a median score of 1/5 (1 2.3) at baseline and 5/5 (4.8 - 5) after six months (p = 0.006). …”
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    Article
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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