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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
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    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. by Rodríguez Vázquez, Carlos Alfonso

    Published 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Get full text
    Tesis
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    El valor de la cartera de clientes de empresas de telecomunicaciones en México (The value of customer portfolio for telecommunication companies in Mexico) by Saldaña, J., Palomo, M.

    Published 2006
    “…Puesto que el valor de un cliente cambia para reflejar tanto la identidad del grupo al que se suma como el efecto anticipado en la predictibilidad del mismo. Este análisis esta diseñado para captar la correlación entre la tasa riesgo-retorno del cliente y la de la cartera general teniendo como resultado la contribución al valor vitalicio al riesgo de una cartera de clientes de empresas de telecomunicaciones.…”
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