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  1. 261

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
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    Tesis
  2. 262
  3. 263

    CALIDAD BACTERIOLOGICA DE ENSALADAS DE ZANAHORIA RALLADA Y EFICACIA DE TRATAMIENTOS PREVIOS A SU CONSUMO por Gentili Alejandro, Raúl, Marzocca, María Alejandra, Oriani, Alejandra Soledad, Baldini, Mónica Diana

    Publicado 2017
    “…Discussion: It should be pointed out the importance of the microbiological quality of raw material, since the 35% of the samples do not reach the requirements even applying the treatment with hypochlorite. …”
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    Artículo

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