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Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards.
Publicado 2016“…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
Enlace del recurso
Tesis -
266
Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards.
Publicado 2016“…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
Enlace del recurso
Tesis -
267
Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave.
Publicado 2018“…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
Enlace del recurso
Tesis -
268
Caracterización de recubrimientos depositados por PVD para sensores de temperatura de frenos de una aeronave.
Publicado 2018“…The samples exposed in saline did not show oxidation points. For the anodic curves, both for the substrate and the coatings showed a tendency to pseudopassivation in the different solutions. …”
Enlace del recurso
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An exact algorithm to solve a cloud service bilevel problem.
Publicado 2018Enlace del recurso
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An exact algorithm to solve a cloud service bilevel problem.
Publicado 2018Enlace del recurso
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