Resultados de búsqueda - ((((esto OR tested) OR estos) OR oeste) OR (est OR (estaoa OR (restaoso OR estas)))) point*

  1. 201

    Metodologías para la Evaluación de Activos Intangibles por Palomo González, Miguel Ángel

    Publicado 2005
    “…Their presentation and amount in the enterprise’s balance sheet is the starting point in a management process for intangible assets which continue with the value generation and improvement in future periods. …”
    Enlace del recurso
    Artículo
  2. 202
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  7. 207

    Las teorías de la localización de la inversión extranjera directa (IED): una aproximación (Localization theories of the foreign direct investment: an approach) por Villarreal, C.

    Publicado 2004
    “…The concepts are presented and fundamental definitions related to the theme are pointed out. Finally, I offer a new perspective as how to conduct reasearch on this subject.…”
    Enlace del recurso
    Artículo
  8. 208
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  11. 211

    Development and Evaluation of An In-House Lumbar Puncture Simulator for First-Year Resident Lumbar Puncture Procedure Learning por Muñoz Leija, David, Díaz González Colmenero, Fernando, Ramiréz Mendoza, Diego A, López Cabrera, Norma Guadalupe, Llanes Garza, Hilda Alicia, Palacios Ríos, Dionicio, Negreros Osuna, Adrian Antonio

    Publicado 2024
    “…While there were no apparent differences in median self-confidence scores between the groups at any time point, the experimental group had a significant increase in their self-confidence for performing an unassisted LP, with a median score of 1/5 (1 2.3) at baseline and 5/5 (4.8 - 5) after six months (p = 0.006). …”
    Enlace del recurso
    Artículo
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  14. 214

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
  15. 215

    Thermomechanical Performance of fr-4 Laminates in the Manufacturing Process of Printed Circuit Boards. por Rodríguez Vázquez, Carlos Alfonso

    Publicado 2016
    “…In 2006 the Restriction of Hazardous Substances (RoHS) prohibited the use of lead (Pb) in solder paste, which has a melting temperature around 180oC, whereas lead-free solder pastes have a melting point around 230oC, 30oC-40oC higher than Pb solder paste, this has generated PCB thermo mechanical problems due to the temperature increase at which the material is exposed. …”
    Enlace del recurso
    Tesis
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  20. 220

    Bioestratigrafía y microfacies de la formación cuesta del cura (cretácico inferior) en la Cañada Guadalupe del municipio de Iturbide, Nuevo León, México. por Coronado Díaz, Miroslava

    Publicado 2018
    “…The scarcity of information available to the focal points of this research is based on more complex organisms such as ammonoids and other macroscopic organisms, which is why the lack of studies based on foraminifera has not allowed establish more concrete biostratigraphic sequences. …”
    Enlace del recurso
    Tesis

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